RT Journal Article
T1 Single-etch subwavelength engineered fiber-chip grating couplers for 1.3 µm datacom wavelength band.
A1 Benedikovic, Daniel
A1 Alonso-Ramos, Carlos
A1 Cheben, Pavel
A1 Schmid, Jens H
A1 Wang, Shurui
A1 Halir, Robert
A1 Ortega-Moñux, Alejandro
A1 Xu, Dan-Xia
A1 Vivien, Laurent
A1 Lapointe, Jean
A1 Janz, Siegfried
A1 Dado, Milan
AB We report, for the first time, on the design and experimental demonstration of fiber-chip surface grating couplers based on subwavelength grating engineered nanostructure operating in the low fiber chromatic dispersion window (around 1.3 μm wavelengths), which is of great interest for short-reach data communication applications. Our coupler designs meet the minimum feature size requirements of large-volume deep-ultraviolet stepper lithography processes. The fiber-chip couplers are implemented in a standard 220-nm-thick silicon-on-insulator (SOI) platform and are fabricated by using a single etch process. Several types of couplers are presented, specifically the uniform, the apodized, and the focusing designs. The measured peak coupling efficiency is -2.5 dB (56%) near the central wavelength of 1.3 μm. In addition, by utilizing the technique of the backside substrate metallization underneath the grating couplers, the coupling efficiency of up to -0.5 dB (89%) is predicted by Finite Difference Time Domain (FDTD) calculations.
YR 2016
FD 2016
LK https://hdl.handle.net/10668/25285
UL https://hdl.handle.net/10668/25285
LA en
DS RISalud
RD Apr 6, 2025